Pellicle Demounter

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APD-6000

  • 반도체 Wafer용 Photo Mask에 접착되어진 Pellicle를
    자동으로 제거.
  • Pellicle Shift (500㎛) Mask도 완벽히 제거.
  • Pellicle Demounting Pressure 정밀 Control.
  • 6" Photo Mask 전용 장비.
  • Option : SMIF.(Photo Mask Loading/Unloading)

SPECIFICATION

Dimension (mm)700 (W) x 850 (D) x 2000 (H)
Weight (kg)Approximately 150 kg
Demounting Accuracy≤500 ㎛
Demounting Torque0.3~15 kg
Demounting Time1~9999 sec
Demounting Temperature25~200 ℃
Demounting Method

- Mask Heating

- Control Demounting Pressure & Range & Speed

- Auto-align Pellicle & Mask Clamping

- Upper Direction Demounting

Equipment Condition

- Edit Recipe & Process Log Save

- PLC Control
- PC Operation (HMI)

- 6" Photo Mask

- Equipment safety : CE or S2,S8 Certification

Option

- Barcode Reading System
- ULPA Filter & Ionizer System

- SMIF System 

- CCTV  Recorder (4ch, about 20days Save)

Utility - Power : 1Phase AC200~220V, 50/60Hz
- CDA : ¼” (0.5~0.7 Mpa)
- Exhaust : Φ100 mm ( >100 Pa)