Pellicle Demounter

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APD-6000SD

  • 반도체 Wafer용 Photo Mask에 접착되어진 Pellicle를
    자동으로 제거.
  • Pellicle Shift (500㎛) Mask도 완벽히 제거.
  • Demounting 후 Pellicle Adhesive Residue 32 points
    자동촬영.
  • Pellicle Demounting Pressure 정밀 Control.
  • Photo Mask Loading/Unloading.(Clean Robot 사용)
  • Mask Loading/Unloading을 OHT를 이용한 무인 자동화.

SPECIFICATION

Dimension (mm)1300 (W) x 2000 (D) x 2080 (H)
Weight (kg)Approximately 635 kg
Demounting Accuracy≤500 ㎛
Demounting Torque0.3~15 kg
Demounting Time1~9999 sec
Demounting Temperature25~200 ℃
Demounting Method

- Mask Heating

- Control Demounting Pressure & Range & Speed

- Auto-align Pellicle & Mask Clamping

- Auto Measuring Pellilce Adhesive Image by a Microscope system

- Upper Direction Demounting

Equipment Condition

- ULPA Filter

- Mask Barcode & Pod RFID Reading

- Edit Recipe & Process Log Save
- GEM300 Communication Application
- PLC Control
- PC Operation (HMI)
- CCTV Recorder (4ch, about 20days save)
- Pod Load/Unload : OHT (E84 Application)

- Load Port : 2 Port
- 4 Axis Mask Transfer Clean Robot

- Mask Flip (0° , 180°)

Option - Chemical Filter
- Ionizer System
Utility - Power : 1Phase AC200~220V, 50/60Hz
- CDA : ¼” (0.5~0.7 Mpa)
- Exhaust : Φ100 mm ( >100 Pa)